Organic light emtting display device

ABSTRACT

An organic light emitting display device includes: a substrate; a display unit on the substrate; and an encapsulation layer on the display unit, the encapsulation layer including a plurality of inorganic layers and a plurality of organic layers, the plurality of inorganic layers and the plurality of organic layers being alternately located, and the plurality of organic layers being at a region where the plurality of inorganic layers is located. The plurality of inorganic layers covers the display unit and is sequentially on the substrate, and areas of each of the inorganic layers are increased moving in a direction away from the display unit.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to and the benefit of Korean Patent Application No. 10-2012-0131458, filed on Nov. 20, 2012, with the Korean Intellectual Property Office, the present invention of which is incorporated herein in its entirety by reference.

TECHNICAL FIELD

Embodiments of the present invention relate to an organic light emitting display device, and more particularly, to an organic light emitting display device that reduces (or prevents) penetration of moisture into ends of inorganic layers and a lifting phenomenon between inorganic layers, by increasing areas of a plurality of inorganic layers included in a thin film encapsulation layer in sequence.

BACKGROUND

An organic light emitting display device is a self-emission display device which has an organic light emitting diode that emits light to display an image. Since an organic light emitting display device generally does not require a separate light source unlike a liquid crystal display, it is possible to relatively reduce a thickness and weight thereof. In addition, an organic light emitting display device may exhibit characteristics such as low power consumption, high luminance, and a rapid response speed.

In an organic light emitting display device, a display unit may deteriorate due to penetration of oxygen or moisture. Accordingly, in order to reduce (or prevent) oxygen or moisture from penetrating from the outside, an encapsulation structure for sealing and protecting the display unit may be used.

For example, an encapsulation structure including a thin film encapsulation structure which covers the display unit by a multilayer, in which organic layers and inorganic layers are alternately laminated, has been adopted. That is, the display unit is sealed by alternately laminating the organic layers and the inorganic layers on the display unit of the substrate. Here, the organic layers may function to give flexibility to a flat panel display, and the inorganic layers may function to reduce (or prevent) penetration of oxygen or moisture.

SUMMARY

Aspects of embodiments of the present invention provide an organic light emitting display device for improving an encapsulation structure to more efficiently protect an organic light emitting diode unit. For example, some embodiments of the present invention provide an organic light emitting display device for reducing (or preventing) a lifting phenomenon of edges of inorganic layers and more efficiently blocking moisture and oxygen from penetrating.

An exemplary embodiment of the present invention provides an organic light emitting display device, including: a substrate; a display unit on the substrate; and an encapsulation layer on the display unit, the encapsulation layer including a plurality of inorganic layers and a plurality of organic layers, the plurality of inorganic layers and the plurality of organic layers being alternately located, and the plurality of organic layers being at a region where the plurality of inorganic layers is located. The plurality of inorganic layers covers the display unit and is sequentially on the substrate, and areas of each of the inorganic layers are increased moving in a direction away from the display unit.

An outermost layer of the encapsulation layer may be formed by a corresponding one of the inorganic layers.

An edge of the encapsulation layer may include the plurality of inorganic layers sequentially on the substrate, and in the plurality of inorganic layers, an upper inorganic layer may cover an end of a lower inorganic layer.

In the plurality of organic layers, areas of each of the organic layers may be increased moving in the direction away from the display unit.

The organic light emitting display device may further include an encapsulation protecting layer covering the encapsulation layer.

The encapsulation protecting layer may be an organic layer.

The display unit may include a first electrode on the substrate; an emission layer on the first electrode; and a second electrode on the emission layer.

At least one of a hole injection layer or a hole transfer layer may be between the first electrode and the emission layer.

At least one of an electron transport layer or an electron injection layer may be between the emission layer and the second electrode.

A capping layer may be between the display unit and the encapsulation layer.

The capping layer may include a transparent material having ultraviolet light absorbing capacity.

A thickness of each inorganic layer of the plurality of inorganic layers may be in a range of about 10 nm to about 50 nm.

A thickness of each organic layer of the plurality of organic layers may be in a range of about 10 nm to about 50 nm.

Another exemplary embodiment of the present invention provides a manufacturing method of an organic light emitting display device, the method including: forming a display unit on a substrate; and forming an encapsulation layer on the display unit, the forming of the encapsulation layer including: forming a first inorganic layer on the display unit; and laminating organic layers and inorganic layers on the first inorganic layer in sequence, the organic layers being in a region where the inorganic layers are disposed. An upper inorganic layer completely covers a lower inorganic layer and the organic layers.

The organic layers and the inorganic layers may be laminated many times.

The number of times of laminating the organic layers and the inorganic layers may be 2 to 30 times.

An outermost layer of the encapsulation layer may be formed by a corresponding one of the inorganic layers.

The upper inorganic layer may cover an end of the lower inorganic layer.

The manufacturing method of the organic light emitting display device may further include forming an encapsulation protecting layer covering the encapsulation layer, after the laminating the organic layers and the inorganic layers.

The forming the display unit may include forming a first electrode on the substrate; forming an emission layer on the first electrode; and forming a second electrode on the emission layer.

The manufacturing method of the organic light emitting display device may further include forming a capping layer on the display unit, after the forming the display unit.

A thickness of each of the inorganic layers may be in a range of about 10 nm to 50 nm.

A thickness of each of the organic layers may be in a range of about 10 nm to 50 nm.

In the organic light emitting display device according to an exemplary embodiment of the present invention, it is possible to reduce (or prevent) a lifting phenomenon between inorganic layers which are in contact with each other and reduce (or block) penetration of oxygen or moisture into edges of the inorganic layers.

The foregoing summary is illustrative only and is not intended to be in any way limiting. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features will become apparent by reference to the drawings and the following detailed description.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view schematically illustrating an organic light emitting display device according to an exemplary embodiment of the present invention.

FIG. 2 is a cross-sectional view enlarging an encapsulation layer in the organic light emitting display device of FIG. 1.

FIG. 3 is a diagram illustrating the organic light emitting display device illustrated in FIG. 1 in more detail.

FIG. 4 is a cross-sectional view illustrating an organic light emitting display device according to another exemplary embodiment of the present invention.

FIGS. 5A to 5C are diagrams schematically illustrating a manufacturing process of an organic light emitting display device according to an exemplary embodiment of the present invention.

DETAILED DESCRIPTION

Hereinafter, exemplary embodiments of the present invention will be described in more detail with reference to the accompanying drawings. However, the scope of the present invention is not limited to the following examples and drawings. Exemplary embodiments to be described below and illustrated in the drawings may include various equivalences and modifications.

The terminology used in this specification is used in order to express exemplary embodiments of the present invention and may depend on the intention of users or operators or the custom in the art to which the present invention belongs. Accordingly, the terminology should be viewed in the context of the details described throughout this specification.

For reference, respective components and shapes thereof may be schematically drawn or exaggeratedly drawn in the accompanying drawings for ease of understanding. Like reference numerals designate like elements throughout the drawings.

Further, it will be understood that when a layer or an element is described as being “on” another layer or element, it may be directly disposed on another layer or element, or an intervening layer or element may also be present.

FIG. 1 is a cross-sectional view schematically illustrating an organic light emitting display device according to an exemplary embodiment of the present invention. Referring to FIG. 1, the organic light emitting display device according to an exemplary embodiment of the present invention includes a substrate 100, a display unit 200 formed on the substrate 100, and an encapsulation layer 300 formed on the display unit 200.

The substrate 100 may be made of various materials such as a glass substrate, a quartz substrate, and a transparent resin substrate, and may be formed by using a flexible material. The transparent resin substrate which may be used as the substrate 100 may contain a polyimide resin, an acrylic resin, a polyacrylate resin, a polycarbonate resin, a polyether resin, a polyethylene terephthalate resin, a sulfonic acid resin, and the like.

In the case where the organic light emitting diode display is a rear emission type and an image is displayed toward the substrate 100 side, the substrate 100 may be made of a light transmitting material, but in the case of a front emission type where an image is displayed toward the encapsulation layer 300 side, the substrate 100 may not necessarily be made of a light transmitting material.

The display unit 200 is an element including an emission layer 230. A detailed configuration according to an embodiment will be described below.

In one embodiment, the encapsulation layer 300 has a structure in which organic layers 320 and inorganic layers 310 are alternately laminated. In order to reduce (or prevent) oxygen or moisture from penetrating from the outside, the organic layers 320 may be positioned at the inner side of the encapsulation layer 300, adjacent to the display unit, and the inorganic layers 310 may be positioned toward the outer side of encapsulation layer, away from the display unit.

The inorganic layers 310 may be laminated to have substantially the same size, and in this case, a space may be formed between ends of two inorganic layers 310 which are in contact with each other at edges of the inorganic layers 310, and as a result, a lifting phenomenon between the inorganic layers 310 occurs, and oxygen or moisture may penetrate between the ends of the inorganic layers 310.

FIG. 2 is a cross-sectional view enlarging an encapsulation layer in the organic light emitting display device of FIG. 1.

Referring to FIG. 2, the encapsulation layer 300 may include a plurality of inorganic layers 310 and a plurality of organic layers 320. The plurality of inorganic layers 310 and the plurality of organic layers 320 may be alternately laminated.

The outermost layer of the encapsulation layer 300 is constituted by the inorganic layer 310.

In FIG. 2, the plurality of inorganic layers 310 includes a first inorganic layer 311, a second inorganic layer 312, and a third inorganic layer 313. However, embodiments of the present invention are not limited thereto, and the inorganic layers 310 may be formed with four or more layers.

In FIG. 2, the plurality of organic layers 320 includes a first organic layer 321 and a second organic layer 322. However, embodiments of the present invention are not limited thereto, and the organic layers 320 may be formed with three or more layers.

The plurality of organic layers 320 may be formed in a region where the plurality of inorganic layers 310 is disposed.

For example, the first organic layer 321 may be formed in a region where the first inorganic layer 311 and the second inorganic layer 312 are disposed, and the second organic layer 322 may be formed in a region where the second inorganic layer 312 and the third inorganic layer 313 are disposed. That is, the organic layers 320 may be completely covered by the inorganic layers 310 formed on the organic layers 320.

For example, the first organic layer 321 may be formed on the first inorganic layer 311 and formed in the region of the first inorganic layer 311. The second inorganic layer 312 may be formed on the first organic layer 321, and the second inorganic layer 312 may completely cover the first organic layer 321 up to the first inorganic layer 311. The second organic layer 322 and the third inorganic layer 313 may be continuously formed by the method.

The plurality of inorganic layers 310 may cover the display unit 200 and may be laminated on the substrate 100 in sequence, and areas thereof may be increased moving in a direction away from the display unit 200.

For example, an area of the first inorganic layer 311 may be smaller than an area of the second inorganic layer 312, and an area of the second inorganic layer 312 may be smaller than an area of the third inorganic layer 313. An area of the plurality of inorganic layers 310 may be formed to cover all of the laminated inorganic layers 310 and organic layers 320 (e.g., the lower laminated inorganic layers 310 and organic layers 320).

According to an embodiment, since the areas of the plurality of organic layers 320 are smaller than the areas of the plurality of inorganic layers 310, the edge of the encapsulation layer 300 may have a structure in which the plurality of inorganic layers 310 is sequentially laminated on the substrate 100. That is, the plurality of inorganic layers 310 may have a structure in which the upper inorganic layer covers the end of the lower inorganic layer. The upper inorganic layer may mean that the inorganic layer is relatively far away from the substrate 100 in a vertical direction of the substrate 100, and the lower inorganic layer may mean that the inorganic layer is relatively close to the substrate 100 in the vertical direction of the substrate 100.

Accordingly, since the upper inorganic layer covers up to the lower inorganic layer, the organic light emitting display device according to an exemplary embodiment of the present invention may suppress the lifting phenomenon between the adjacent layers at the edge of the encapsulation layer 300 and may reduce (or block) penetration of oxygen or moisture.

Meanwhile, the areas of the plurality of organic layers 320 may be increased moving in a direction away from the display unit 200. Since the areas of the plurality of inorganic layers 310 are increased moving in a direction away from the display unit 200, the areas of the plurality of organic layers 320 included in the region where the plurality of inorganic layers 310 is disposed are increased in proportion to the degree that the areas of the plurality of inorganic layers 310 are increased.

Thin film materials which may be used as the inorganic layers 310 and the organic layers 320, and a laminating method of the inorganic layers 310 and the organic layers 320, are without specific limitation and may be any material or method known in the art.

For example, the thin film material which is used as the inorganic layers 310 may contain at least one selected from a group constituted by silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, and titanium oxide.

The thin film material which is used as the organic layers 320 may contain at least one selected from a group constituted by epoxy, acrylate, urethane acrylate, polyurea, polyacrylate, PTCDA, BPDA, and PMDA.

However, any inorganic thin film materials or organic thin film materials which are known in the art may be used as the materials of the inorganic layers 310 or the organic layers 320 of the present invention.

The inorganic layers 310 and the organic layers 320 may be formed by using a spin coating process, a printing process, a sputtering process, a chemical vapor deposition (CVD) process, an atomic layer deposition (ALD) process, a plasma enhanced chemical vapor deposition (PECVD) process, a high density plasma-chemical vapor deposition (HDP-CVD) process, a vacuum deposition process, and the like according to a material for forming the encapsulation layer 300.

A thickness of each inorganic layer 310 configuring the plurality of inorganic layers 310 may be in the range of 10 nm to 50 nm.

When the thickness of each inorganic layer 310 is less than 10 nm, the penetration of moisture and oxygen may not be sufficiently blocked, and when the thickness of each inorganic layer 310 is more than 50 nm, the thickness of the organic light emitting display device may be increased and thus the organic light emitting display device may be an obstacle to thinness.

Meanwhile, as the inorganic layers 310 become thicker, the stress of the inorganic layers may be increased and thus the lifting phenomenon of the inorganic layers 310 may occur.

A thickness of each organic layer 320 configuring the plurality of organic layers 320 may be in the range of 10 nm to 50 nm. When the thickness of each organic layer 320 is less than 10 nm, it may be difficult to ensure flexibility of the organic light emitting display device, and when the thickness of each organic layer 320 is more than 50 nm, there may be a problem in that the thickness of the organic light emitting display device is increased. However, the numerical ranges of the inorganic layers 310 and the organic layers 320 may be changed according to a use and a function of a thin film encapsulation layer.

FIG. 3 is a diagram illustrating the organic light emitting display device illustrated in FIG. 1 in more detail.

Referring to FIG. 3, the display unit 200 may include a first electrode 210 formed on the substrate 100, a pixel defining layer (PDL) 220 formed between the first electrodes 210, an emission layer 230 formed on the first electrode 210, and a second electrode 240 formed on the emission layer 230.

In the case where an organic light emitting display device is a front emission type, the first electrode 210 may contain at least one of gold (Au), platinum (Pt), nickel (Ni), tungsten (W), chromium (Cr), molybdenum (Mo), iron (Fe), cobalt (Co), copper (Cu), palladium (Pd), titanium (Ti), and a compound thereof. In addition, the second electrode 240 may contain at least one of indium tin oxide (ITO) and indium zinc oxide (IZO), which are transparent conductive oxides.

In the case where the organic light emitting display device is a rear emission type, the first electrode 210 may contain at least one of indium tin oxide (ITO) and indium zinc oxide (IZO), which are transparent conductive oxides having a high work function. In addition, the second electrode 240 may be made of metal having a low work function, that is, alkali metals such as lithium (Li) and cesium (Cs), alkaline earth metals such as magnesium (Mg), calcium (Ca) and strontium (Sr), and a compound thereof.

The first electrode 210 and the second electrode 240 may contain any materials which are known in the art.

The pixel defining layer 220 may be made of a material having an insulation property to partition the first electrodes 210 into pixel units. For example, the pixel defining layer 220 may be disposed at an edge of the first electrode 210 to partition the first electrodes into pixel unit and define pixel areas. The pixel defining layer 220 may cover the edge of the first electrode 210.

The emission layer 230 may include a red emission layer, a green emission layer, and a blue emission layer.

A hole injection layer (HIL) 250 and a hole transfer layer (HTL) 260 may be included between the first electrode 210 and the emission layer 230, and an electron transport layer (ETL) 270 and an electron injection layer (EIL) 280 may be included between the emission layer 230 and the second electrode 240.

A capping layer 400 may be disposed between the display unit 200 and the encapsulation layer 300, and the capping layer 400 may be made of a transparent material having ultraviolet light absorbing capacity.

FIG. 4 is a cross-sectional view illustrating an organic light emitting display device according to another exemplary embodiment of the present invention. Referring to FIG. 4, the organic light emitting display device according to another exemplary embodiment of the present invention may further include an encapsulation protecting layer 500 covering the encapsulation layer 300.

The encapsulation protecting layer 500 may seal the edge of the encapsulation layer 300 once more. Accordingly, the encapsulation protecting layer 500 may reduce (or prevent) the lifting phenomenon between the inorganic layers 310, increase an effect of reducing (or blocking) the penetration of oxygen or moisture, and better protect the organic light emitting display device from mechanical and physical damages applied from the outside.

The encapsulation protecting layer 500 may be made of an organic material, and the organic material may be the same as the material of the plurality of organic layers 320.

A thickness of the encapsulation protecting layer 500 may be approximately 1 to 20 μm. When the thickness of the encapsulation protecting layer 500 is less than 1 μm, the organic light emitting display device may be damaged due to external factors, and when the thickness of the encapsulation protecting layer 500 is more than 20 μm, there may be a problem in that the thickness of the organic light emitting display device is increased.

FIGS. 5A to 5C are diagrams schematically illustrating a manufacturing process of the organic light emitting display device according to an exemplary embodiment of the present invention.

In step (a), the first inorganic layer 311 is formed on the substrate 100 having the display unit 200 (see FIG. 5A). In step (b), the encapsulation layer 300 is formed on the display unit 200.

Step (b) includes step (c) and step (d) (see FIG. 5B).

In step (c), the first inorganic layer 311 covers the entire display unit 200 and a part of the substrate 100.

After step (c), in step (d), the first organic layer 321 is formed on the first inorganic layer 311, and the second inorganic layer 312 covers the first organic layer 321 and the first inorganic layer 311 (see FIG. 5B).

After step (d), laminating the inorganic layers 310 and the organic layers 320 in sequence may be repeated one or more times.

For example, after forming the second inorganic layer 312, the second organic layer 322 is formed on the second inorganic layer 312, and the third inorganic layer 313 covers the second inorganic layer 312 and the second organic layer 322 (see FIG. 5C). That is, in each step of forming the plurality of inorganic layers 310, the areas of the plurality of inorganic layers 310 may be largely formed to cover up to the ends of the already formed inorganic layers 310. The laminating of the plurality of organic layers 320 and the plurality of inorganic layers 310 in sequence may be performed 2 to 30 times.

From the foregoing, it will be appreciated that various embodiments of the present invention have been described herein for purposes of illustration, and that various modifications may be made without departing from the scope and spirit of the present invention. Accordingly, the various embodiments disclosed herein are not intended to be limiting, with the true scope and spirit being indicated by the following claims and their equivalents. 

What is claimed is:
 1. An organic light emitting display device, comprising: a substrate; a display unit on the substrate; and an encapsulation layer on the display unit, wherein the encapsulation layer comprises a plurality of inorganic layers and a plurality of organic layers, the plurality of inorganic layers and the plurality of organic layers being alternately located, and the plurality of organic layers being at a region where the plurality of inorganic layers is located, and wherein the plurality of inorganic layers covers the display unit and is sequentially on the substrate, and areas of each of the inorganic layers are increased moving in a direction away from the display unit.
 2. The organic light emitting display device of claim 1, wherein an outermost layer of the encapsulation layer is formed by a corresponding one of the inorganic layers.
 3. The organic light emitting display device of claim 1, wherein an edge of the encapsulation layer comprises the plurality of inorganic layers sequentially on the substrate, and in the plurality of inorganic layers, an upper inorganic layer covers an end of a lower inorganic layer.
 4. The organic light emitting display device of claim 1, wherein in the plurality of organic layers, areas of each of the organic layers are increased moving in the direction away from the display unit.
 5. The organic light emitting display device of claim 1, further comprising: an encapsulation protecting layer covering the encapsulation layer.
 6. The organic light emitting display device of claim 5, wherein the encapsulation protecting layer is an organic layer.
 7. The organic light emitting display device of claim 1, wherein the display unit comprises a first electrode on the substrate; an emission layer on the first electrode; and a second electrode on the emission layer.
 8. The organic light emitting display device of claim 7, wherein at least one of a hole injection layer or a hole transfer layer is between the first electrode and the emission layer.
 9. The organic light emitting display device of claim 7, wherein at least one of an electron transport layer or an electron injection layer is between the emission layer and the second electrode.
 10. The organic light emitting display device of claim 1, wherein a capping layer is between the display unit and the encapsulation layer.
 11. The organic light emitting display device of claim 10, wherein the capping layer comprises a transparent material having ultraviolet light absorbing capacity.
 12. The organic light emitting display device of claim 1, wherein a thickness of each inorganic layer of the plurality of inorganic layers is in a range of about 10 nm to about 50 nm.
 13. The organic light emitting display device of claim 1, wherein a thickness of each organic layer of the plurality of organic layers is in a range of about 10 nm to about 50 nm.
 14. A manufacturing method of an organic light emitting display device, the method comprising: forming a display unit on a substrate; and forming an encapsulation layer on the display unit, wherein the forming of the encapsulation layer comprises: forming a first inorganic layer on the display unit; and laminating organic layers and inorganic layers on the first inorganic layer in sequence, the organic layers being in a region where the inorganic layers are disposed, wherein an upper inorganic layer completely covers a lower inorganic layer and the organic layers.
 15. The manufacturing method of claim 14, wherein the organic layers and the inorganic layers are laminated many times.
 16. The manufacturing method of claim 15, wherein the number of times of laminating the organic layers and the inorganic layers is 2 to 30 times.
 17. The manufacturing method of claim 14, wherein an outermost layer of the encapsulation layer is formed by a corresponding one of the inorganic layers.
 18. The manufacturing method of claim 14, wherein the upper inorganic layer covers an end of the lower inorganic layer.
 19. The manufacturing method of claim 14, further comprising: forming an encapsulation protecting layer covering the encapsulation layer, after the laminating the organic layers and the inorganic layers.
 20. The manufacturing method of claim 14, wherein the forming the display unit comprises forming a first electrode on the substrate; forming an emission layer on the first electrode; and forming a second electrode on the emission layer.
 21. The manufacturing method of claim 14, further comprising: forming a capping layer on the display unit, after the forming the display unit.
 22. The manufacturing method of claim 14, wherein a thickness of each of the inorganic layers is in a range of about 10 nm to 50 nm.
 23. The manufacturing method of claim 14, wherein a thickness of each of the organic layers is in a range of about 10 nm to 50 nm. 